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1/20 xc8102 series load switch with low on-resistance (current limit 400ma) step down dc/dc xc9235 li-ion dc/dc out 3.6v 2.1v xc8102 vin ce vss vout xc8102 vin ce vss vout xc8102 vin ce vss vout on/off control on/off control cl cl cl on/off control cin cin cin cpu cpu cpu in in in vin vout applications mobile phones, smart phones digital still cameras, digital video cameras portable game consoles portable equipment general description the xc8102 series is a low on resistance load switch ic with on/off control and output current protection which integrates a p-channel mosfet. by connecting the xc8102 to the output pin of a step-down dc/dc converter, t he ce pin controls on/off for each distribution switch to deliver power per requirements and maximize total power efficiency. as a result, the xc8102 helps to extend battery life and product operation time. the series contains a current limit and prot ection circuit so these are not required externally unlike discrete circuit solutio ns where mosfets and resistors are used. when a low signal is input to the ce pin, the series enters stand-by mode. even where a load capacitor is connected to the output pin during stand-by, the electric char ge stored at the load capacitor is dischar ged through the internal switch. as a result, the v out pin voltage falls quickly to the v ss level. the series contains over current protection with fold-back cu rrent circuitry which operates as over current protection and short circuit protection for the output pin. typical application circuit typical performance characteristics etr2502-008 features on resistance : 0.28 ? @ v in =6.0v (typ.) 0.31 ? @ v in =4.0v (typ.) 0.35 ? @ v in =2.9v (typ.) 0.52 ? @ v in =1.8v (typ.) 0.60 ? @ v in =1.5v (typ.) 0.80 ? @ v in =1.2v (typ.) input voltage range : 1.2v 6.0v power consumption : 3.0 a@ v in =1.2v 3.6 a@ v in =2.9v 4.0 a@ v in =6.0v stand-by current : 0.1 a protection circuit : current limit(output current) 400ma (1.8 Q v in Q 6.0v) short-circuit protection, short current= 30ma (typ.) on/off function : active high enable high-speed discharge function operating ambient temperature : -40 +85 packages : usp-4,ssot-24, sot-25 uspn-4 environmentally friendly : eu rohs compliant, pb free xc8102aa01m/xc8102aa01g 0.0 0.2 0.4 0.6 0.8 1.0 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 input voltage : vin (v) on resistance : ron ( ? v in=ce iout=50ma cin=none,cl=none ta=85 25 -40 on resistance vs. input voltage
2/20 xc8102 series pin number usp-4 sot-25 ssot-24 uspn-4 pin name functions 4 1 4 4 v in power input 1 5 3 1 v out output 2 2 2 2 v ss ground 3 3 1 3 ce on/off control 4 - nc no connection designator item symbol description ce pin logic a ce high active c l discharge function a output capacitor (c l ) auto-discharge function integrated ? internal standard number 01 fixed gr-g usp-4 (3,000/reel) mr-g sot-25 (3,000/reel) nr-g ssot-24 (3,000/reel) ?- ( *1 ) packages (order unit) 7r-g uspn-4 (5,000/reel) pin configuration pin assignment product classification ordering information xc8102 ?????- ( *1 ) *the heat dissipation pad of the usp-4 package is recommended to solder as shown in the recommended mount pattern and metal mask pa ttern for mounting st rength. the heat dissipation pad should be electrica lly opened or connected to the v ss (no. 2) pin. (*1) the ?-g? suffix denotes halogen and antimony free as well as being fully rohs compliant.
3/20 xc8102 series * ce pin should not be left open. series ce ic operational status on/off h on l off xc8102aa01 open undefined state parameter symbol ratings units input voltage v in -0.3 +6.5 v 850 (*1) output current i out 750(uspn-4) (*1) ma output voltage v out -0.3 v in v ce input voltage v ce -0.3 +6.5 v usp-4 120 ssot-24 150 sot-25 250 power dissipation uspn-4 pd 100 mw operating ambient temperature topr -40 +85 o c storage temperature ts t g -55 +125 o c block diagram a bsolute maximum ratings function chart each circuit on/off control gate control current limit v in v ss v out xc8102aa` ce rdischg ce/ * diodes inside the circuit are an esd protection diode and a parasitic diode. h = high level l = low level xc8102aa series (*1) please make sure that i out is less than pd/ (v in -v out )
4/20 xc8102 series parameter symbol conditions min. typ. max. units circuits input voltage v in 1.2 - 6.0 v - v in =6.0v, v ce =v in - 0.28 0.425 v in =4.0v, v ce =v in - 0.31 0.475 v in =2.9v, v ce =v in - 0.35 0.475 v in =1.8v, v ce =v in - 0.52 0.625 v in =1.5v, v ce =v in - 0.60 0.80 on resistance (ssot-24/uspn-4) r on v in =1.2v, v ce =v in - 0.80 1.60 ? v in =6.0v, v ce =v in - 0.35 0.475 v in =4.0v, v ce =v in - 0.38 0.525 v in =2.9v, v ce =v in - 0.43 0.525 v in =1.8v, v ce =v in - 0.59 0.675 v in =1.5v, v ce =v in - 0.67 0.85 on resistance (sot-25/usp-4) r on v in =1.2v, v ce =v in - 0.87 1.65 ? v in =6.0v, v ce =v in , v out =open - 4.0 7.0 v in =4.0v, v ce =v in , v out =open - 3.8 6.5 v in =2.9v, v ce =v in , v out =open - 3.6 6.3 v in =1.8v, v ce =v in , v out =open - 3.4 5.7 v in =1.5v, v ce =v in , v out =open - 3.2 5.5 supply current i dd v in =1.2v, v ce =v in , v out =open - 3.0 4.9 a stand-by current i stby v in =6.0v, v ce =v ss , v out =open - 0.01 0.10 a switch leakage current i leak v in =6.0v, v ce =v ss , v out =0v - 0.01 0.10 a v in R 2.9v, v out = v in -0.8v 400 480 - 1.8v Q v in 2.9v, v out = v in -0.6v 400 480 - 1.5v Q v in 1.8v, v out =1.2v 200 - - current limit i lim 1.2v Q v in 1.5v, v out =1.0v 90 - - ma short circuit current i short v ce =v in , v out =0v - 30 75 ma ce high level voltage v ceh 1.1 - 6.0 v ce low level voltage v cel - - 0.3 v ce high level current i ceh v ce =v in -0.1 - 0.1 a ce low level current i cel v ce =v ss -0.1 - 0.1 a c l auto-discharge resistance r dchg v in =4.0v, v out =4.0v, v ce =v ss 380 480 570 ? turn on time (*1) t dly(on) v in =4.0v, v ce =0.3v 1.2v, r l =80 ? , without c in , c l - 8.5 18 s turn off time (*2) t dly(off) v in =4.0v, v ce =1.2v 0.3v, r l =80 ? , without c in , c l - 3.0 7.5 s electrical characteristics xc8102 series ta = 2 5 note: *1: time to reach 90% of v out after v ce entering the v ceh threshold. *2: time to fall to 10% of v out after v ce entering the v cel threshold.
5/20 xc8102 series vin vout ce vss a v ishort iout v test circuits circuit circuit circuit
6/20 xc8102 series rl test circuits (continued) circuit circuit the measurement point of wave form the measurement point of wave form
7/20 xc8102 series the xc8102 enables an output p-channel mosfet switch and the ic internal circuitry to turn off by the signal to the ce pin. in the shutdown mode, the v out pin will be pulled down to the v ss by the c l auto-discharge function. the output voltage becomes unstable when the ce pin is opened. if the input voltage to the ce pin is within the specified threshold voltages, the logic is fixed and the xc8102 will operat e normally. however, supply current may increase as a result of the shoot-through current of intern al circuitry when the medium level voltage is input to the ce pin. input/output capacitor the xc8102 works well without an input and output capacitors. also, an output capacitor of the power source can be used as an input capacitor of the xc8102 and a bypass capacitor of the driving ic can be used as an out put capacitor of the xc8102. the xc8102aa contains a c l auto-discharge resistor and an n- channel transistor between the v out pin and the v ss pin. the device quickly discharge the electric charge in the output capacitor (c l ) when a low signal to the ce pin is input to turn off a whole ic circuit. the c l auto-discharge resistance is set at 480 (v out =4.0v typ. @ v in =4.0). discharge time of the output capacitor (c l ) is determined by a c l auto-discharge resistor value (rdischg) and an output capacitor value. time constant is defined as ( = c x rdischg). output voltage after starting discharge can be calculated by the following formula. v = v out x e ?t/ , or t= in (v out / v) v: output voltage after starting discharge , v out: output voltage , t : discharge time , : output discharge resistor value rdischg output capacitor (c l ) value c the xc8102 series contains a constant curr ent limiter and fold-back current circuitry. the constant current limiter operates t o limit output current and the fold-back current circuitry operat es as short circuit protection for the output pin. when the load current reaches the limit current, the constant cu rrent limiter operates and the out put voltage drops. the outpu t voltage further, then the fold-back current circuitry operat es to decrease the output current. when the output pin is short-circuited to the ground, the output curre nt drops and maintains a flow about 30ma. notes on use operational explanation 1. for temporary, transitional voltage drop or voltage rising phe nomenon, the ic is liable to malfunction should the ratings be exceeded. 2. the x8102 goes into an undefined operation when the ce pin is left open. the ce pin shall be tied to low or high level. 3. v out pin voltage should not be applied beyond the v in pin voltage. the ic may get damage due to the reverse current toward the v in pin. 4. the xc8102 has constant current start-up. please keep the start-up sequence to draw lo ad current after raising the output voltage. 5. current limit function is in tegrated. however, power dissipation may be beyon d the limit before starting a fold-back current protection when used in high temperature. for the power dissipation of each package, please refer to the graphs of package power vs. operating temperature in page 15 to 18. 6. torex places an importance on improv ing our products and their reliability. we request that users incorporate fail-safe designs and post-agi ng protection treatment when using torex products in their systems.
8/20 xc8102 series xc8102aa01n/xc8102aa017 0.0 0.2 0.4 0.6 0.8 1.0 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 input voltage : vin (v) on resistance : ron ( ? vin=ce iout=50ma cin=none,cl=none ta=85 25 -40 xc8102aa01m/xc8102aa01g 0.0 0.2 0.4 0.6 0.8 1.0 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 input voltage : vin (v) on resistance : ron ( ? vin=ce iout=50ma cin=none,cl=none ta=85 25 -40 xc8102aa01m/xc8102aa01g 0.0 0.2 0.4 0.6 0.8 1.0 -50 -25 0 25 50 75 100 ambient temp : ta ( ) on resistance : ron ( ? vin=ce iout=50ma cin=none,cl=none vin=1.2v 1.5v 1.8v 2.9v 4.0v 6.0v xc8102aa01n/xc8102aa017 0.0 0.2 0.4 0.6 0.8 1.0 -50 -25 0 25 50 75 100 ambient temp : ta ( ) on resistance : ron ( ? v in=ce iout=5 0ma cin=none,cl=none vin=1.2v 1.5v 1.8v 2.9v 4.0v 6.0v xc8102aa01 0.0 1.0 2.0 3.0 4.0 5.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 input voltage : vin (v) supply current : idd (ua ) v in=ce cin=none,cl=none ta=85 25 -40 xc8102aa01 0.0 1.0 2.0 3.0 4.0 5.0 -50 -25 0 25 50 75 100 ambient temp : ta ( ) supply current : idd (ua ) vin=c e cin=none,cl=none vin=1.2v 1.5v 1.8v 2.9v 4.0v 6.0v typical performance characteristics (1) on resistance vs. input voltage (2) on resistance vs. ambient temperature (3) supply current vs. input voltage (4) supply current vs. ambient temperature
9/20 xc8102 series xc8102aa01m/xc8102aa01g 0.0 1.0 2.0 3.0 4.0 5.0 0 100 200 300 400 500 600 output current : iout (ma) output voltage : vout (v) vin=ce=1.2v cin=none,cl=none ta=85 25 -40 xc8102aa01m/xc8102aa01g 0.0 1.0 2.0 3.0 4.0 5.0 0 100 200 300 400 500 600 output current : iout (ma) output voltage : vout (v) v in=ce=1.5v cin=none,cl=none ta=85 25 -40 xc8102aa01m/xc8102aa01g 0.0 1.0 2.0 3.0 4.0 5.0 0 100 200 300 400 500 600 output current : iout (ma) output voltage : vout (v) vin=ce=1.8v cin=none,cl=none ta=85 25 -40 xc8102aa01m/xc8102aa01g 0.0 1.0 2.0 3.0 4.0 5.0 0 100 200 300 400 500 600 output current : iout (ma) output voltage : vout (v) v in=ce=2.9v cin=none,cl=none ta=85 25 -40 xc8102aa01m/xc8102aa01g 0.0 2.0 4.0 6.0 8.0 10.0 0 100 200 300 400 500 600 output current : iout (ma) output voltage : vout (v) v in=ce=4.0v cin=none,cl=none ta=85 25 -40 xc8102aa01m/xc8102aa01g 0.0 2.0 4.0 6.0 8.0 10.0 0 100 200 300 400 500 600 output current : iout (ma) output voltage : vout (v) vin=ce=6.0v cin=none,cl=none ta=85 25 -40 (5) output voltage vs. output current typical performance characteristics (continued)
10/20 xc8102 series xc8102aa01n/xc8102aa017 0.0 1.0 2.0 3.0 4.0 5.0 0 100 200 300 400 500 600 output current : iout (ma) output voltage : vout (v) vin=ce=1.2v cin=none,cl=none ta=85 25 -40 xc8102aa01n/xc8102aa017 0.0 1.0 2.0 3.0 4.0 5.0 0 100 200 300 400 500 600 output current : iout (ma) output voltage : vout (v) v in=ce=1.5v cin=none,cl=none ta=85 25 -40 xc8102aa01n/xc8102aa017 0.0 1.0 2.0 3.0 4.0 5.0 0 100 200 300 400 500 600 output current : iout (ma) output voltage : vout (v) vin=ce=1.8v cin=none,cl=none ta=85 25 -40 xc8102aa01n/xc8102aa017 0.0 1.0 2.0 3.0 4.0 5.0 0 100 200 300 400 500 600 output current : iout (ma) output voltage : vout (v) v in=ce=2.9v cin=none,cl=none ta=85 25 -40 xc8102aa01n/xc8102aa017 0.0 2.0 4.0 6.0 8.0 10.0 0 100 200 300 400 500 600 output current : iout (ma) output voltage : vout (v) v in=ce=4.0v cin=none,cl=none ta=85 25 -40 xc8102aa01n/xc8102aa017 0.0 2.0 4.0 6.0 8.0 10.0 0 100 200 300 400 500 600 output current : iout (ma) output voltage : vout (v) vin=ce=6.0v cin=none,cl=none ta=85 25 -40 typical performance characteristics (continued) (5) output voltage vs. output current
11/20 xc8102 series xc8102aa01 0.4 0.5 0.6 0.7 0.8 0.9 1.0 -50 -25 0 25 50 75 100 ambient temp : ta ( ) ce high level voltage : vceh (v ) vin=6.0v cin=none,cl=none vceh vcel xc8102aa01 0 500 1000 1500 2000 2500 3000 -50 -25 0 25 50 75 100 ambient temp : ta ( ) discharge resistance : rdischg ( ? ) vin=vout ce=v ss cin=none,cl=none vin=1.2v vin=1.5v vin=1.8v vin=2.9v vin=4.0v vin=6.0v xc8102aa01 -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 time: 10 s/div ce input voltage: vce (v) -1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 output voltage :vout (v) vin=1.2v ce=0.3v 1.2v tr=tf=5 s , iout=50ma cin=none , cl=none ce input voltage output voltage xc8102aa01 -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 time: 10 s/div ce input voltage: vce (v) -1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 output voltage :vout (v) vin=1.5v ce=0.3v 1.2v tr=tf=5 s , iout=50ma cin=none , cl=none ce input v oltage output voltage xc8102aa01 -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 time: 10 s/div ce input voltage: vce (v) -1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 output voltage :vout (v) vin=1.8v ce=0.3v 1.2v tr=tf=5 s , iout=50ma cin=none , cl=none ce input voltage output voltage xc8102aa01 -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 time: 10 s/div ce input voltage: vce (v) -1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 output voltage :vout (v) vin=2.9v ce=0.3v 1.2v tr=tf=5 s , iout=50ma cin=none , cl=none ce input v oltage output voltage (6) ce threshold voltage vs. ambient temperature (7) cl discharge resistance vs. ambient temperature (8) output turn-on time with ce typical performance characteristics (continued)
12/20 xc8102 series xc8102aa01 -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 time: 10 s/div ce input voltage: vce (v) -2.0 0.0 2.0 4.0 6.0 8.0 10.0 12.0 output voltage :vout (v) vin=4.0v ce=0.3v 1.2v tr=tf=5 s , iout=50ma cin=none , cl=none ce input voltage output voltage xc8102aa01 -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 time: 10 s/div ce input voltage: vce (v) -2.0 0.0 2.0 4.0 6.0 8.0 10.0 12.0 output voltage :vout (v) vin=6.0v ce=0.3v 1.2v tr=tf=5 s , iout=50ma cin=none , cl=none ce input voltage output voltage xc8102aa01 -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 time: 10 s/div ce input voltage: vce (v) -1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 output voltage :vout (v) vin=1.2v ce=1.2v 0.3v tr=tf=5 s , iout=50ma cin=none , cl=none ce input voltage output voltage xc8102aa01 -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 time: 10 s/div ce input voltage: vce (v) -1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 output voltage :vout (v) vin=1.5v ce=1.2v 0.3v tr=tf=5 s , iout=50ma cin=none , cl=none ce input v oltage output voltage xc8102aa01 -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 time: 10 s/div ce input voltage: vce (v) -1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 output voltage :vout (v) vin=1.8v ce=1.2v 0.3v tr=tf=5 s , iout=50ma cin=none , cl=none ce input voltage output voltage xc8102aa01 -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 time: 5 s/div ce input voltage: vce (v) -1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 output voltage :vout (v) vin=2.9v ce=1.2v 0.3v tr=tf=5 s , iout=50ma cin=none , cl=none ce input voltage output voltage (9) output turn-off time with ce typical performance characteristics (continued) (8) output turn-on time with ce (continued)
13/20 xc8102 series xc8102aa01 -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 time: 5 s/div ce input voltage: vce (v) -2.0 0.0 2.0 4.0 6.0 8.0 10.0 12.0 output voltage :vout (v) vin=4.0v ce=1.2v 0.3v tr=tf=5 s , iout=50ma cin=none , cl=none ce input voltage output voltage xc8102aa01 -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 time: 5 s/div ce input voltage: vce (v) -2.0 0.0 2.0 4.0 6.0 8.0 10.0 12.0 output voltage :vout (v) vin=6.0v ce=1.2v 0.3v tr=tf=5 s , iout=50ma cin=none , cl=none ce input voltage output voltage typical performance characteristics (continued) (9) output turn-off time with ce (continued)
14/20 xc8102 series packaging information sot-25 ssot-24 usp-4 uspn-4 unit : mm unit : mm unit : mm unit : mm
15/20 xc8102 series sot-25 power dissipation board mount (tj max = 125 ) ambient temperature power dissipation pd mw thermal resistance ( /w) 25 600 85 240 166.67 u??gmm pd-ta? 0 100 200 300 400 500 600 700 25 45 65 85 105 125 x?ta S?p?pdmw packaging information (continued) power dissipation data for the sot-25 is shown in this page. the value of power dissipation varies with the mount board conditions. please use this data as one of reference data taken in the described condition. evaluation board (unit: mm) 2. power dissipation vs. ambient temperature pd vs. ta ambient temperature ta ( ) power dissipation pd (mw) 1. measurement condit ion (reference data) condition: mount on a board ambient: natural convection soldering: lead (pb) free board: dimensions 40 x 40 mm (1600 mm 2 in one side) copper (cu) traces occupy 50% of the board area in top and back faces package heat-sink is tied to the copper traces (board of sot-26 is used) material:glass epoxy (fr-4) thickness: 1.6 mm through-hole: 4 x 0.8 diameter
16/20 xc8102 series ssot-24 power dissipation board mount (tj max = 125 ) ambient temperature power dissipation pd mw thermal resistance ( /w) 25 500 85 200 200.00 packaging information (continued) power dissipation data for the ssot-24 is shown in this page. the value of power dissipation varies with the mount board conditions. please use this data as one of reference data taken in the described condition. 1. measurement condit ion (reference data) condition: mount on a board ambient: natural convection soldering: lead (pb) free board: dimensions 40 x 40 mm (1600 mm 2 in one side) copper (cu) traces occupy 50% of the board area in top and back faces package heat-sink is tied to the copper traces material: glass epoxy (fr-4) thickness: 1.6 mm through-hole: 4 x 0.8 diameter 40.0 40.0 2.54 2.5 28.9 28.9 1.4 evaluation board (unit: mm) 2. power dissipation vs. ambient temperature pd-ta? 0 100 200 300 400 500 600 25 45 65 85 105 125 x?ta S?p?pd mw pd vs. ta power dissipation pd (mw) ambient temperature ta ( )
17/20 xc8102 series usp-4 power dissipation board mount (tj max = 125 ) ambient temperature power dissipation pd mw thermal resistance ( /w) 25 1000 85 400 100.00 packaging information (continued) power dissipation data for the usp-4 is shown in this page. the value of power dissipation varies with the mount board conditions. please use this data as one of reference data taken in the described condition. 1. measurement condit ion (reference data) condition: mount on a board ambient: natural convection soldering: lead (pb) free board: dimensions 40 x 40 mm (1600 mm 2 in one side) copper (cu) traces occupy 50% of the board area in top and back faces package heat-sink is tied to the copper traces material: glass epoxy (fr-4) thickness: 1.6 mm through-hole: 4 x 0.8 diameter 40.0 2.5 28.9 evaluation board (unit: mm) 2. power dissipation vs. ambient temperature pd vs ta 0 200 400 600 800 1000 1200 25 45 65 85 105 125 ambient temperature ta power dissipation pd (mw)
18/20 xc8102 series uspn-4 power dissipation board mount (tj max = 125 ) ambient temperature power dissipation pd mw thermal resistance ( /w) 25 640 85 240 166.67 packaging information (continued) power dissipation data for the uspn-4 is shown in this page. the value of power dissipation varies with the mount board conditions. please use this data as one of reference data taken in the described condition. 1. measurement condit ion (reference data) condition: mount on a board ambient: natural convection soldering: lead (pb) free board: dimensions 40 x 40 mm (1600 mm 2 in one side) copper (cu) traces occupy 50% of the board area in top and back faces package heat-sink is tied to the copper traces material: glass epoxy (fr-4) thickness: 1.6 mm through-hole: 4 x 0.8 diameter evaluation board (unit: mm) 2. power dissipation vs. ambient temperature 40.0 2.5 28.9 pd-ta? 0 100 200 300 400 500 600 700 25 45 65 85 105 125 ??ta S?p?pdmw power dissipation pd (mw) pd vs ta ambient tem p erature ta ( )
19/20 xc8102 series sot-25 usp-4 ssot-24 uspn-4 mark product series c xc8102****** mark product series f xc8102a***** mark product series c xc8102*a**** mark product series c xc8102****** mark product series 5 xc8102aa**** marking rule sot-25 (top view) usp-4 (top view) represents product series represents ce pin logic represents c l discharge function ? represents production lot number 01, ?,09, 0a, ?,0z, 11,?,9z, a1, ?, a9, aa, ?, z9, za,?,zz repeated. (g, i, j, o, q, w excluded) *no character inversion used. ssot-24 (top view) uspn-4 (top view) represents product series represents ce pin logic and c l discharge function ? represents production lot number 01, ?,09, 0a, ?,0z, 11,?,9z, a1, ?, a9, aa, ?, z9, za,?,zz repeated. (g, i, j, o, q, w excluded) *no character inversion used.
20/20 xc8102 series 1. the products and product specifications cont ained herein are subject to change without notice to improve performance characteristic s. consult us, or our representatives before use, to confirm that the informat ion in this datasheet is up to date. 2. we assume no responsibility for any infri ngement of patents, pat ent rights, or other rights arising from the use of any information and circuitry in this datasheet. 3. please ensure suitable shipping controls (including fail-safe designs and aging protection) are in force for equipment employing products listed in this datasheet. 4. the products in this datasheet are not devel oped, designed, or approved for use with such equipment whose failure of malfuncti on can be reasonably expected to directly endanger the life of, or cause significant injury to, the user. (e.g. atomic energy; aerospace; transpor t; combustion and associated safety equipment thereof.) 5. please use the products listed in this datasheet within the specified ranges. should you wish to use the products under conditions exceeding the specifications, please consult us or our representatives. 6. we assume no responsibility for damage or loss due to abnormal use. 7. all rights reserved. no part of this dat asheet may be copied or reproduced without the prior permission of torex semiconductor ltd.

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